4 inch Sapphire Wafer C-Plane SSP/DSP 0.43mm 0.65mm

Looking for 4 inch Sapphire Wafers? Our factory offers C-plane SSP/DSP wafers in 0.43mm and 0.65mm thicknesses. Shop now for high-quality products.

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  • 4 inch Sapphire Wafer C-Plane SSP/DSP 0.43mm 0.65mm
  • 4 inch Sapphire Wafer C-Plane SSP/DSP 0.43mm 0.65mm

PRODUCTS DETAILS

● Growth substrate for III-V and II-VI compounds. ● Electronics and optoelectronics. ● IR applications. ● Silicon On Sapphire Integrated Circuit(SOS). ● Radio Frequency Integrated Circuit(RFIC). In LED production, sapphire wafers are used as a substrate for the growth of gallium nitride (GaN) crystals, which emit light when an electric current is applied. Sapphire is an ideal substrate material for GaN growth because it has a similar crystal structure and thermal expansion coefficient to GaN, which minimizes defects and improves crystal quality. In optics, sapphire wafers are used as windows and lenses in high-pressure and high-temperature environments, as well as in infrared imaging systems, because of their high transparency and hardness.
Item 4-inch C-plane(0001) 650μm Sapphire Wafers
Crystal Materials 99,999%, High Purity, Monocrystalline Al2O3
Grade Prime, Epi-Ready
Surface Orientation C-plane(0001)
C-plane off-angle toward M-axis 0.2 +/- 0.1°
Diameter 100.0 mm +/- 0.1 mm
Thickness 650 μm +/- 25 μm
Primary Flat Orientation A-plane(11-20) +/- 0.2°
Primary Flat Length 30.0 mm +/- 1.0 mm
Single Side Polished Front Surface Epi-polished, Ra < 0.2 nm (by AFM)
(SSP) Back Surface Fine ground, Ra = 0.8 μm to 1.2 μm
Double Side Polished Front Surface Epi-polished, Ra < 0.2 nm (by AFM)
(DSP) Back Surface Epi-polished, Ra < 0.2 nm (by AFM)
TTV < 20 μm
BOW < 20 μm
WARP < 20 μm
Cleaning / Packaging Class 100 cleanroom cleaning and vacuum packaging,
25 pieces in one cassette packaging or single piece packaging.
Generally speaking, we provide the package by 25pcs cassette box; we also can packed by single wafer container under 100 grade cleaning room according to the client's requirement.

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